WE WERE AT THE POLAND WARSAW PACK 2025 FAIR!
- ESZİP
- Sep 9
- 1 min read
We participated in the WARSAW PACK 2025 International Packaging Technology Fair, held in Warsaw, Poland, from April 8th to 10th, 2025. As Eszip, we were delighted to meet with leading companies in the industry and showcase our latest solutions.
We would like to thank all the participants who visited our booth during this event, where we had the opportunity to present our innovative products and services in packaging technology.
Date: April 8th - 10th, 2025
Location: Warsaw, Poland
Booth: E5.06b
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